lite-on technology corporation property of lite-on only features * low power consumption. * high efficiency. * versatile mounting on p.c. board or panel. * i.c. compatible/low current requirement. * popular t-1 3/4 diameter. package dimensions part no. lens source color LTL2R3TGK water clear ingan green notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25mm(.010") unless otherwise noted. 3. protruded resin under flange is 1.0mm(.04") max. 4. lead spacing is measured where th e leads emerge from the package. 5. specifications are subject to change without notice. part no. : LTL2R3TGK page : 1 of 10 bns-od-c131/a4
lite-on technology corporation property of lite-on only absolute maximum ratings at t a =25 parameter maximum rating unit power dissipation 120 mw peak forward current (1/10 duty cycle, 0.1ms pulse width) 100 ma dc forward current 30 ma reverse voltage 5 v operating temperature range -25c to + 80c storage temperature range -30c to + 100c lead soldering temperature [1.6mm(.063") from body] 260c for 5 seconds part no. : LTL2R3TGK page : 2 of 10 bns-od-c131/a4
lite-on technology corporation property of lite-on only electrical / optical characteristics at t a =25 parameter symbol min. typ. max. unit test condition luminous intensity i v 2500 6000 mcd i f = 20ma note 1,5 viewing angle 2 1/2 20 deg note 2 (fig.6) dominant wavelength d 525 nm note 3 spectral line half-width ? 35 nm forward voltage v f 3.5 4.0 v i f = 20ma reverse current i r 100 a v r = 5v note: 1. luminous intensity is measured with a light sensor and filter combination that approximates the cie eye-response curve. 2. 1/2 is the off-axis angle at which the luminous in tensity is half the axial luminous intensity. 3. the dominant wavelength, d is derived from the cie chromaticity diagram and represents the single wavelength which defines the color of the device. 4. iv classification code is marked on each packing bag. 5. the iv guarantee should be added 15 tolerance. 6. precautions in handling: ? when soldering, leave 2mm of minimum clear ance from the resin to the soldering point. ? dipping the resin to solder must be avoided. ? correcting the soldered position after soldering must be avoided. ? in soldering, do not apply any stress to th e lead frame particularly when heated. ? when forming a lead, make sure not to apply any stress inside the resin. ? lead forming must be done before soldering. ? it is necessary to cut the lead frame at normal temperature. 7. caution in esd: static electricity and surge damag es the led. it is recommend to use a wrist band or anti-electrostatic glove when handling the led. a ll devices, equipment and machinery must be properly grounded. part no. : LTL2R3TGK page : 3 of 10 bns-od-c131/a4
lite-on technology corporation property of lite-on only typical electrical / optical characteristics curves (25 ambient temperature unless otherwise noted) part no. : LTL2R3TGK page : 4 of 10 bns-od-c131/a4
lite-on technology corporation property of lite-on only packing spec 500 or 250 pcs per packing bag 10 packing bags per inner carton total 5000 pcs per inner carton 8 inner cartons per outer carton total 40000 pcs per outer carton in every shipping lot, on ly the last pack will be non-full packing part no. : LTL2R3TGK page : 5 of 10 bns-od-c131/a4
lite-on technology corporation property of lite-on only bin code list for reference luminous intensity unit : mcd @20ma bin code min. max. t2 2500 3390 u1 3390 4510 u2 4510 5990 v1 5990 7960 v2 7960 10600 note: tolerance of each bin limit is 15% part no. : LTL2R3TGK page : 6 of 10 bns-od-c131/a4
lite-on technology corporation property of lite-on only cautions 1. application the leds described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).c onsult liteon?s sales in advance for information on applications in which exceptional relia bility is required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 2. storage the storage ambient for the leds should not exceed 30c temperature or 70% relative humidity. it is recommended that leds out of their origin al packaging are used within three months. for extended storage out of their original packagi ng, it is recommended that the leds be stored in a sealed container with appropriate desiccan t or in desiccators with nitrogen ambient. 3. cleaning use alcohol-based cleaning solvents such as is opropyl alcohol to clean the leds if necessary. 4. lead forming & assembly during lead forming, the leads should be bent at a point at least 3mm from the base of led lens. do not use the base of the lead frame as a fulcrum during forming. lead forming must be done before soldering, at normal temperature. during assembly on pcb, use minimum clinch force possible to avoid excessive mechanical stress. 5. soldering when soldering, leave a minimum of 2mm clearance from the b ase of the lens to the soldering point. dipping the lens into the solder must be avoided. do not apply any external stress to the lead frame dur ing soldering while the led is at high temperature. recommended soldering conditions : soldering iron wave soldering temperature soldering time 300c max. 3 sec. max. (one time only) pre-heat pre-heat time solder wave soldering time 100c max. 60 sec. max. 260c max. 10 sec. max. note: excessive soldering temperature and/or time mi ght result in deformation of the led lens or catastrophic failure of the led part no. : LTL2R3TGK page : 7 of 10 bns-od-c131/a4
lite-on technology corporation property of lite-on only 6. drive method an led is a current-operated device. in orde r to ensure intensity uniformity on multiple leds connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in seri es with each led as shown in circuit a below. circuit model a circuit model b led led (a) recommended circuit (b) the brightness of each led might appear di fferent due to the differences in the i-v characteristics of those leds 7. esd (electrostatic discharge) static electricity or power surge will damage the led. suggestions to prevent esd damage: ? use a conductive wrist band or anti- electrostatic glove when handling these leds ? all devices, equipment, and machinery must be properly grounded ? work tables, storage racks, etc. should be properly grounded ? use ion blower to neutralize the static charge which might have built up on surface of the leds plastic lens as a result of friction between leds during storage and handing part no. : LTL2R3TGK page : 8 of 10 bns-od-c131/a4
lite-on technology corporation property of lite-on only suggested checking list : training and certification 1. everyone working in a static-safe area is esd-certified? 2. training records kept and re-certification dates monitored? static-safe workstation & work areas 1. static-safe workstation or work-areas have esd signs? 2. all surfaces and objects at all static-safe workstation and within 1 ft measure less than 100v? 3. all ionizer activated, positioned towards the units? 4. each work surface mats grounding is good? personnel grounding 1. every person (including visitors) handling esd sens itive (esds) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 2. if conductive footwear used, conductive floor ing also present where operator stand or walk? 3. garments, hairs or anything closer than 1 ft to esd items measure less than 100v*? 4. every wrist strap or heel strap/conductive s hoes checked daily and resu lt recorded for all dsl? 5. all wrist strap or heel strap checkers calibration up to date? note: *50v for blue led. device handling 1. every esds items identified by eia-471 labels on item or packaging? 2. all esds items completely inside properly closed static-shielding containers when not at static-safe workstation? 3. no static charge generators (e.g. plasti cs) inside shielding containers with esds items? 4. all flexible conductive and dissipative packag e materials inspected before reuse or recycle? others 1. audit result reported to entity esd control coordinator? 2. corrective action from previous audits completed? 3. are audit records complete and on file? part no. : LTL2R3TGK page : 9 of 10 bns-od-c131/a4
lite-on technology corporation property of lite-on only 8. reliability test classification test item test condition reference standard operation life ta= under room temperature as per data sheet maximum rating * test time= 1000hrs (-24hrs,+72hrs) mil-std-750d:1026 (1995) mil-std-883d:1005 (1991) jis c 7021:b-1 (1982) high temperature high humidity storage ta= 655 rh= 90 ? 95% test time= 240hrs2hrs mil-std-202f: 103b(1980) jis c 7021 : b-11(1982) high temperature high humidity reverse bias ta= 655 rh= 90 ? 95% vr=5v test time = 500hrs (-24hrs, +48hrs) jis c 7021 : b-11(1982) high temperature storage ta= 1055 * test time= 1000hrs (-24hrs,+72hrs) mil-std-883d:1008 (1991) jis c 7021:b-10 (1982) endurance test low temperature storage ta= -555 * test time=1000hrs (-24hrs,+72hrs) jis c 7021:b-12 (1982) temperature cycling 105 ? 25 ? -55 ? 25 30mins 5mins 30mins 5mins 10 cycles mil-std-202f:107d (1980) mil-std-750d:1051(1995) mil-std-883d:1010 (1991) jis c 7021: a-4(1982) thermal shock 105 5 ? -55 5 10mins 10mins 10 cycles mil-std-202f:107d(1980) mil-std-750d:1051(1995) mil-std-883d:1011 (1991) solder resistance t.sol = 260 5 dwell time= 10 1secs mil-std-202f:210a(1980) mil-std-750d:2031(1995) jis c 7021: a-1(1982) environmental test solderability t. sol = 230 5 dwell time= 5 1secs mil-std-202f:208d(1980) mil-std-750d:2026(1995) mil-std-883d:2003(1991) jis c 7021: a-2(1982) 9. others the appearance and specifications of the product may be modified for improvement, without prior notice. part no. : LTL2R3TGK page : 10 of 10 bns-od-c131/a4
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